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| Part Name | Platinum Target | Specifications | 304.8 L x 228.6 W x 6 H mm (customized) (Option: Target Bonded to Backing Plate) |
| Material | Pt | Purity | 99.99% |
| Common Applications | Semiconductor, Wafer & Chip, Microelectronic Senser, Aerospace, 5G Photoelectricity, Functional Coating | ||
Target material is one of the main materials for preparing thin films, mainly used in integrated circuits, flat panel displays, solar cells, recording media, smart glass, etc., with high requirements for material purity and stability. The working principle of sputtering target material: sputtering is one of the main technologies for preparing thin film materials. It uses ions generated by ion sources to accelerate and aggregate in vacuum, forming a high-speed ion beam that bombards the solid surface. The ions exchange kinetic energy with the solid surface atoms, causing the solid surface atoms to leave the solid and deposit on the substrate surface. The bombarded solid is the sputtering target material.
Introducing our Platinum Sputtering Target - the perfect solution for your semiconductor and chip manufacturing needs.
Crafted with utmost precision and using the highest quality platinum material, our Platinum Sputtering Target is designed to deliver exceptional performance and reliability.
Ideal for applications in the semiconductor industry, this platinum target ensures optimal deposition and uniformity, allowing for precise and efficient production of advanced electronic devices.
With its superior purity and exceptional durability, our Platinum Sputtering Target guarantees consistent results, minimizing downtime and maximizing productivity.
Trust in our professional-grade Platinum Sputtering Target to meet the demanding requirements of your semiconductor and chip manufacturing processes. Experience the difference in quality and performance with our platinum target.
| Part Name | Platinum Target | Specifications | 304.8 L x 228.6 W x 6 H mm (customized) (Option: Target Bonded to Backing Plate) |
| Material | Pt | Purity | 99.99% |
| Common Applications | Semiconductor, Wafer & Chip, Microelectronic Senser, Aerospace, 5G Photoelectricity, Functional Coating | ||
Target material is one of the main materials for preparing thin films, mainly used in integrated circuits, flat panel displays, solar cells, recording media, smart glass, etc., with high requirements for material purity and stability. The working principle of sputtering target material: sputtering is one of the main technologies for preparing thin film materials. It uses ions generated by ion sources to accelerate and aggregate in vacuum, forming a high-speed ion beam that bombards the solid surface. The ions exchange kinetic energy with the solid surface atoms, causing the solid surface atoms to leave the solid and deposit on the substrate surface. The bombarded solid is the sputtering target material.
Introducing our Platinum Sputtering Target - the perfect solution for your semiconductor and chip manufacturing needs.
Crafted with utmost precision and using the highest quality platinum material, our Platinum Sputtering Target is designed to deliver exceptional performance and reliability.
Ideal for applications in the semiconductor industry, this platinum target ensures optimal deposition and uniformity, allowing for precise and efficient production of advanced electronic devices.
With its superior purity and exceptional durability, our Platinum Sputtering Target guarantees consistent results, minimizing downtime and maximizing productivity.
Trust in our professional-grade Platinum Sputtering Target to meet the demanding requirements of your semiconductor and chip manufacturing processes. Experience the difference in quality and performance with our platinum target.
