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| Part Name | Tin Silver Copper Target | Specifications | Ø203.2 x 3mm Thickness (customized) (Option: Target Bonded to Backing Plate) |
| Material | SAC | Purity | 99.99% |
| Common Applications | Semiconductor, Wafer & Chip, Microelectronic Senser, Aerospace, 5G Photoelectricity, Functional Coating | ||
Target material is one of the main materials for preparing thin films, mainly used in integrated circuits, flat panel displays, solar cells, recording media, smart glass, etc., with high requirements for material purity and stability. The working principle of sputtering target material: sputtering is one of the main technologies for preparing thin film materials. It uses ions generated by ion sources to accelerate and aggregate in vacuum, forming a high-speed ion beam that bombards the solid surface. The ions exchange kinetic energy with the solid surface atoms, causing the solid surface atoms to leave the solid and deposit on the substrate surface. The bombarded solid is the sputtering target material
Introducing our high-quality product - the Tin-Silver-Copper Target. Also known as SAC Target, this product is specifically designed for chip semiconductors.
Crafted with utmost precision, our Tin-Silver-Copper Target offers exceptional performance and reliability. It is the perfect solution for various semiconductor applications, ensuring optimal results and enhanced productivity.
The Tin-Silver-Copper Target, commonly referred to as SAC Target, is meticulously engineered to meet the stringent requirements of the semiconductor industry. Its composition of tin, silver, and copper guarantees superior conductivity, thermal stability, and corrosion resistance.
With its advanced features, our Tin-Silver-Copper Target enables efficient deposition and deposition uniformity, ensuring precise and consistent results. Its exceptional purity and low impurity levels contribute to the overall quality and longevity of your semiconductor devices.
Designed for professionals in the semiconductor industry, our Tin-Silver-Copper Target provides a reliable and cost-effective solution for chip manufacturing. Its exceptional performance and durability make it an ideal choice for various applications, including integrated circuits, memory devices, and microprocessors.
Invest in our Tin-Silver-Copper Target today and experience the difference it can make in your semiconductor manufacturing process. With its exceptional quality and reliability, you can trust our product to meet your highest expectations and deliver outstanding results.
Choose the Tin-Silver-Copper Target - the ultimate choice for chip semiconductors. Trust in our expertise and experience a new level of excellence in your semiconductor manufacturing.
| Part Name | Tin Silver Copper Target | Specifications | Ø203.2 x 3mm Thickness (customized) (Option: Target Bonded to Backing Plate) |
| Material | SAC | Purity | 99.99% |
| Common Applications | Semiconductor, Wafer & Chip, Microelectronic Senser, Aerospace, 5G Photoelectricity, Functional Coating | ||
Target material is one of the main materials for preparing thin films, mainly used in integrated circuits, flat panel displays, solar cells, recording media, smart glass, etc., with high requirements for material purity and stability. The working principle of sputtering target material: sputtering is one of the main technologies for preparing thin film materials. It uses ions generated by ion sources to accelerate and aggregate in vacuum, forming a high-speed ion beam that bombards the solid surface. The ions exchange kinetic energy with the solid surface atoms, causing the solid surface atoms to leave the solid and deposit on the substrate surface. The bombarded solid is the sputtering target material
Introducing our high-quality product - the Tin-Silver-Copper Target. Also known as SAC Target, this product is specifically designed for chip semiconductors.
Crafted with utmost precision, our Tin-Silver-Copper Target offers exceptional performance and reliability. It is the perfect solution for various semiconductor applications, ensuring optimal results and enhanced productivity.
The Tin-Silver-Copper Target, commonly referred to as SAC Target, is meticulously engineered to meet the stringent requirements of the semiconductor industry. Its composition of tin, silver, and copper guarantees superior conductivity, thermal stability, and corrosion resistance.
With its advanced features, our Tin-Silver-Copper Target enables efficient deposition and deposition uniformity, ensuring precise and consistent results. Its exceptional purity and low impurity levels contribute to the overall quality and longevity of your semiconductor devices.
Designed for professionals in the semiconductor industry, our Tin-Silver-Copper Target provides a reliable and cost-effective solution for chip manufacturing. Its exceptional performance and durability make it an ideal choice for various applications, including integrated circuits, memory devices, and microprocessors.
Invest in our Tin-Silver-Copper Target today and experience the difference it can make in your semiconductor manufacturing process. With its exceptional quality and reliability, you can trust our product to meet your highest expectations and deliver outstanding results.
Choose the Tin-Silver-Copper Target - the ultimate choice for chip semiconductors. Trust in our expertise and experience a new level of excellence in your semiconductor manufacturing.
